Patent Pcb Electroless

In 1966 schneble jr et al.

Patent pcb electroless. Method for electroless gold plating of conductive traces on printed circuit boards. There is disclosed a process for electroless plating of a conductive metal layer onto the surface of a non conductive substrate in which the substrate surface is prepared for receiving a coating of activator using conventional methods and the coating of activator is applied by contacting the substrate surface with a stabilized sensitizing solution comprising ions of at least one group viii. Electroless nickel phosphorus plating is a chemical process that deposits an even layer of nickel phosphorus alloy on the surface of a solid substrate like metal or plastic the process involves dipping the substrate in a water solution containing nickel salt and a phosphorus containing reducing agent usually a hypophosphite salt. A method of electrolessly gold plating copper on a printed circuit board pcb.

Starting with a copper patterned pcb steps include. Electroless plating also known as chemical plating or autocatalytic plating is a class of industrial chemical processes that create metal coatings on various materials by autocatalytic chemical reduction of metal cations in a liquid bath. Iii removing excessive noble metal. The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating.

2002 04 02 priority to us10 114 211 priority patent us6733823b2 en. It is the most common version of electroless nickel plating. This is the first is a series of instructables aimed at documenting all the electronics related activities that go on at so make it. This invention relates to a new way of manufacturing printed circuit boards by providing a circuit board with a circuit pattern holes and lands of copper.

And contacting the board with an electroless palladium solution for a sufficient time to provide a final finish layer of palladium at a sufficient thickness to protect the copper deposits in. Southampton makerspace on the south coast uk requests are more than welcome on ebay and other on line sources yo. This class is contrasted with electroplating processes such as galvanization where the reduction is achieved by an externally generated electric current. In their us patent 3 259 559 method for electroless copper plating 87 provided improved chemical methods for imposing a uniform ragged firmly adherent nonporous bright and ductile deposit of copper on an insulating surface acting as a primary object of their invention.

The process comprises the steps i providing such a substrate ii activating of the copper features with noble metal ions.